2020

140. Tae-yil Eom, Joon-Shik Park and Hoo Jeong Lee

Zn(OH)F nanorods for highly sensitive NO2 gas sensor applications, Journal of the Korean Physical Society, 2020, 17, (Accepted)

139. Soonyong Kwon, Tae-Ik Lee, Hoo Jeong Lee and Sehoon Yoo

Improved sinterability of micro-scale copper paste with a reducing agent, Materials Letters, 2020, 269, 127656.

138. Srijita Nundy, Taeyil Eom, Kyung-Yoon Song, Joon Shik Park, and Hoo Jeong Lee

Hydrothermal synthesis of mesoporous ZnO microspheres as NOX gas sensor materials — Calcination effects on microstructure and sensing performance, Ceramics International, 2020, 46, 19354-19364.

137. Yaping Yan, Tae-yil Eom, Shiyu Xu, Pil J. Yoo, Changzeng Yan, Joon Shik Park, and Hoo Jeong Lee

Development of Co(OH)xF2-x Nanosheets for Acetone Gas Sensor Applications: Material Characterization
and Sensor Performance Evaluation, Crystals, 2020, 10, 968.

136. Srijita Nundy, Taeyil Eom, Jungu Kang, Jaehyun Suh, Minwoo Cho, Joon Shik Park, and Hoo Jeong Lee

Flower-shaped ZnO nanomaterials for low-temperature operations in NOX gas sensors, Ceramics International, 2020, 46, 5706-5714.

2019

135. Soonyong Kwon, Hoo Jeong Lee, and Sehoon Yoo

Effects of flux formulation temperature on printing and wetting properties of Sn–3.0Ag–0.5Cu solder, Journal of Materials Science: Materials in Electronics, 2019, 30, 8493–8501.

134. Sun Wook Kim, Minhyeong Lee, Hyunchul Jang, Hoo Jeong Lee, and Dae Hong Ko

Effect of thermal annealing on the strain and microstructures of in-situ phosphorus-doped Si1-xCx films grown on blanket and patterned silicon wafers, Journal of Alloys and Compounds, 2019, 790, 799-808.

133. Jinbum Kim, IlgyouShin, Taejin Park, Jinyong Kim, Seongheum Choi, Sungho Lee, Seongpyo Hong, Hyung Ik Lee, Jung Yeon Won, Taegon Kim, Yihwan Kim, Kihyun Hwang, Hoo Jeong Lee, and Hyoungsub Kim

Pt-doped Ni-silicide films formed by pulsed-laser annealing: Microstructural evolution and thermally robust Ni1-xPtxSi2 formation, Journal of Alloys and Compounds, 2019, 788, 1013-1020.

132. Min Woo Jeong, So Yeon Lee, Hong Bum Park, Hoo Jeong Lee, and Young Chang Joo

Stable Interconnect System for Horizontal Thermoelectric Coolers by Thermodynamic-Based Prediction, Electronic Materials Letters, 2019, 15, 654-662.

131. Ya Ping Yan, Hao Li, Ying Bo Kang, Bo Wang, Tae Yil Eom, Kyeong Youn Song, Srijita Nundy, Min Woo Cho, Chi Won Kang, Puritut Nakhanivej, Jin Yong Lee, Hoo Jeong Lee, and Ho Seok Park

Controllable oxygen-incorporated interlayer expanded ReS2 nanosheets deposited on hollow mesoporous carbon spheres for improved redox kinetics of Li-ion storage, Journal of Materials Chemistry A, 2019, 7, 22070.

130. Fangfang Zhang, Minwoo Cho, Taeyil Eom, Chiwon Kang, Hoojeong Lee

Facile synthesis of manganese cobalt sulfide nanoparticles as high performance supercapacitor electrode, Ceramics International, 2019, 45, 20972-20976.

129. Yaping Yan, Kyeong Youn Song, Minwoo Cho, Tae Hoon Lee, Chiwon Kang, and Hoo Jeong Lee

Ultra-Thin ReS2 Nanosheets Grown on Carbon Black for Advanced Lithium-Ion Battery Anodes, Materials, 2019, 9, 1563.

128. Chiwon Kang, Yongwoo Lee, Ilhwan Kim, Seungmin Hyun, Tae Hoon Lee, Soyeong Yun, Won Sub Yoon, Youngkwang Moon, Jinkee Lee, Sunkook Kim, and Hoo Jeong Lee

Highly Eﬃcient Nanocarbon Coating Layer on the Nanostructured Copper Sulﬁde-Metal Organic Framework Derived Carbon for Advanced Sodium-Ion Battery Anode, Materials, 2019, 8, 1324.

2018

127. Min Woo Jeong, Sekwon Na, Haishan Shin, Hong Bum Park, Hoo Jeong Lee, and Young Chang Joo

Thermomechanical In Situ Monitoring of Bi2Te3 Thin Film and Its Relationship with Microstructure and Thermoelectric Performances, Electronic Materials Letters, 2018, 14, 426–431.

126. Min Jung Son, Jae Won Jeong, Hyunchang Kim, Taik Min Lee, Hoo Jeong Lee, and Inyoung Kim

Effect of particle size distribution on the mechanical and electrical properties of reverse-offset printed Sn–Ag–Cu solder bumps, Journal of Materials Science: Materials in Electronics, 2018, 29, 19620–19631.

125. Min Jung Son, Minwoo Kim, Taik Min Lee, Jihoon Kim, Hoo Jeong Lee, and Inyoung Kim

Mechanical and electrical properties of reverse-offset printed Sn-Ag-Cu solder bumps, Journal of Materials Processing Technology, 2018, 259, 126-133.

124. Jun gu Kang, Joon Shik Park, Byeong Seon An, Cheol Woong Yang, and Hoo Jeong Lee

Nickel Doping on Cobalt Oxide Thin Film Using by Sputtering Process-a Route for Surface Modification for p-type Metal Oxide Gas Sensors, Journal of the Korean Physical Society, 2018, 73, 1867-1872.

123. Haishan Shen, Suhyeon Lee, Jungu Kang, Tae Yil Eom, HooJeong Lee, Chiwon Kang, Seungwoo Han

Thickness effects on the microstructure and electrical/thermoelectric properties of co-evaporated Bi-Te thin films, Journal of Alloys and Compounds, 2018, 767, 522-527.

122. Sunho Kim, Tae Gwang Yun, Chiwon Kang, Min Jung Son, Jun Gu Kang. Il Hwan Kim, Hoo Jeong Lee, Chee Hong An, Byungil Hwang

Facile fabrication of paper-based silver nanostructure electrodes for flexible printed energy storage system, Materials & Design, 2018, 151, 1-7.

121. Tae Yil Eom, Chee Hong Ahn, Jun Gu Kang, Muhammad Saad Salman, Sun Young Lee, Yong Hoon Kim, Hoo Jeong Lee, Chan Mo Kang and Chiwon Kang

Investigation of the evolution of nitrogen defects in flash-lamp-annealed InGaZnO films and their effects on transistor characteristics, Applied Physics Express, 2018, 11, 61104.

120. Ilwhan Kim, Seungmin Hyun, Seunghoon Nam, Hoo Jeong Lee, and Chiwon Kang

Fabrication of three-dimensional crystalline silicon-on-carbon nanotube nanocomposite anode by sputtering and laser annealing for high-performance lithium-ion battery, Japanese Journal of Applied Physics, 2018, 57, 05GE05.

119. Hyena Kwak, Jaehyun Yang, Jungu Kang, Tae Yil Eom, Hyoungsub Kim, Hoo Jeong Lee, and Chiwon Kang

Employment of rapid thermal annealing for solution-processed InGaZnO thin film transistors, Journal of Materials Science: Materials in Electronics, 2018, 29, 8660.

118. Chiwon Kang, and Hoo Jeong Lee

Morphological control of three-dimensional carbon nanotube anode for high-capacity lithium-ion battery, Japanese Journal of Applied Physics, 2018, 57, 05GC05.

117. Ilhwan Kim, Bong Sung Kim, Seunghoon Nam, Hoo Jeong Lee, Ho Kyoon Chung , Sung Min Cho, Thi Hoai Thuong Luu, Seungmin Hyun, and Chiwon Kang

Cross-Linked Poly(vinylidene fluoride-cohexafluoropropene) (PVDF-co-HFP) Gel Polymer Electrolyte for Flexible Li-Ion Battery Integrated with Organic Light Emitting Diode (OLED), Materials, 2018, 11, 543.

116. Minsub Oh, Ilwhan Kim, Hoo Jeong Lee, Seungmin Hyun, and Chiwon Kang

The role of thermal annealing on the microstructures of (Ti, Fe)-alloyed Si thin-film anodes for high-performance Li-ion batteries, RSC Advances, 2018, 8, 9168.

2017

115. Sunho Kim, Bongsung Kim, Sung Min Cho, Hoo Jeong Lee, and Byungil Hwangd

Etchant-free patterning of silver nanowire transparent electrode using dry-film photoresists for organic light-emitting diodes, Materials Letters, 2017, 209, 433-436.

114. Jungu Kang, Joon Shik Park, Hoo Jeong Lee

Pt-doped SnO2 thin film based micro gas sensors with high selectivity to toluene and HCHO, Sensors and Actuators B: Chemical, 2017, 248, 1011-1016.

113. Sunho Kim, Bongsung Kim, Inseob Im, Dongjae Kim, Haeseong Lee, Jaewook Nam, Ho Kyoon Chung, Hoo Jeong Lee, and Sung Min Cho

Employment of gold-coated silver nanowires as transparent conductive electrode for organic light emitting diodes, Nanotechnology, 2017, 28, 345201.

112. Sunho Kim, Tae Yil Eom, Minwoo Cho, Kyeong YounSong, Chee HongAn, Hoo JeongLee, ByungilHwang

Simple transfer of Ag nanowires by dry film photoresist for paper-based flexible electronics, Materials Letters, 2017, 199, 196-199.

111. Chee Hong An, Sunho Kim, Hoo Jeong Lee, and Byungil Hwang

Facile patterning using dry film photo-resists for flexible electronics: Ag nanowire networks and

carbon nanotube networks, Journal of Materials Chemistry C, 2017, 5, 4804-4809.

110. Hyung Cheoul Shim, Ilhwan Kim, Chang Su Woo, Hoo Jeong Lee, and Seungmin Hyun

Nanospherical solid electrolyte interface layer formation in binder-free carbon nanotube aerogel/Si nanohybrids to provide lithium-ion battery anodes with a long-cycle life and high Capacity, Nanoscale, 2017, 9, 4713-4720.

109. SunhoKim, Hak RimJeon, Chee HongAn, Byeong SeonAn, Cheol WoongYang, Hoo Jeong Lee, Byung Mook Weon

Improvement of conductivity of Ag nanowires-networked film using 1,8-diazabicyclo[5,4,0]undec-7-ene (DBU), Materials Letters, 2017, 193, 63-66.

108. Daekyoung Kim, Yan Fu, Sunho Kim, Woosuk Lee, Ki Heon Lee, Ho Kyoon Chung, Hoo Jeong Lee, Heesun Yang, and Heeyeop Chae

Polyethylenimine Ethoxylated-Mediated All-Solution-Processed High-Performance Flexible

Inverted Quantum Dot-Light-Emitting Device, ACS Nano, 2017, 11, 1982-1990.

2016

107. So Young Lee, Seungmin Hyun, Bongkyun Jang, Sangmin Kim, Myoungho Kim, Hoo Jeong Lee, Byung Mook Weon, and Hyung Cheoul Shim

Creation of additional electrical pathways for the robust stretchable electrode by using UV irradiated CNT-elastomer composite, Applied Physics Letters, 2016, 109, 171901.

106. Min-Jung Son, Inyoung Kim, Sangsun Yang, Taik Min Lee, Hoo Jeong Lee

Employment of roll-offset printing for fabrication of solder bump arrays: Harnessing the rheological properties of lead-free solder pastes using particle size distribution, Microelectronic Engineering, 2016, 164, 128-134.

105. Byunghoon Lee, Haseok Jeon, Chee Lip Gan, and Hoo Jeong Lee

Thermal reliability of a bilayer of Ni(P)/Cu as a diffusion barrier for Cu/Sn/Cu bonding, Japanese Journal of Applied Physics, 2016, 55, 06JF03.

104. Ho Yong, Sekwon Na, Jun Gu Gang, HaeSun Shin, Seong Jae Jeon, SeungMin Hyun, and Hoo Jeong Lee

Study on the contact resistance of various metals (Au, Ti, and Sb) on Bi–Te and Sb–Te thermoelectric films, Japanese Journal of Applied Physics, 2016, 55, 06JE03.

103. Sekwon Na, Taeyil Eom, Young Chang Joo, and Hoo Jeong Lee

Effects of the Mo composition of Mo-alloyed Yb/Si contacts on the microstructures and electrical properties, Japanese Journal of Applied Physics, 2016, 55, 06JE01.

102. Sunho Kim, Jungu Kang, Taeyil Eom, Bongjin Moon, and Hoo Jeong Lee

Effects of alkali treatments on Ag nanowire transparent conductive films, Japanese Journal of Applied Physics, 2016, 55, 06JD03.

101. Jaehyun Yang, Hyena Kwak, Youngbin Lee, Yu Seon Kang, Mann-Ho Cho, Jeong Ho Cho, Yong Hoon Kim, Seong Jun Jeong, Seongjun Park, Hoo Jeong Lee, Hyoungsub Kim

MoS2−InGaZnO Heterojunction Phototransistors with Broad Spectral Responsivity, ACS Applied Materials & Interfaces, 2016, 8, 8576-8582.

2015

100. Minsub Oh, Sekwon Na, Chang-Su Woo, Jun Ho Jeong, Sung Soo Kim, Alicja Bachmatiuk, Mark Hermann Rümmeli, Seungmin Hyun, and Hoo Jeong Lee

Observation of electrochemically-driven elemental segregation in Si alloy thin-film anode and its effects on cyclic stability for Li-ion batteries, Advanced Energy Materials, 2015, 5, 1501136.

99. Sunho Kim, Haksoo Lee, Sekwon Na, Eun Jung, Jungu Kang, Daekyung Kim, Sung Min Cho, Heeyeop Chae, Ho Kyoon Chung, Seong bea Kim, Byong Wook Lee, Kyung Eun Kim, Sanghoon Lee, Hyo Jeong Lee, Haekyoung Kim and Hoo Jeong Lee

Enhancement of electrical conductivity of silver nanowires-networked films via the addition of Cs-added TiO2, Nanotechnology, 2015, 26, 135705.

98. Sekwon Na, Jungu Kang, Juyun Choi, Nam Suk Lee, Chan Gyung Park, Hyoungsub Kim, Seok Hee Lee, and Hoo Jeong Lee

Silicidation of Mo-alloyed ytterbium: Mo alloying effects on microstructure evolution and contact properties, Acta Materialia, 2015, 92, 1-7.

97. Yong, Ho; Na, Sekwon; Gang, Jun Gu; Jeon, Seong Jae; Hyun, Seungmin; Lee, Hoo Jeong

Effects of Sb Content (x) on (Bi1−x Sbx)2Te3 Thermoelectric Thin Film Deposited by Effusion Cell Evaporator, Journal of Nanoscience and Nanotechnology, 2015, 15, 8251-8256.

2014

96. Deok Su Jo, Jihae Kim, Karupannan Senthil, Hoo Jeong Lee, Ho Kyoon Chung, Masato Kakihana, Toda Kenji, Takaki Masaki, and Dae Ho Yoon

Influence of amorphous and crystalline type precursor intermediates on the morphology and luminescence properties of green emitting β-Ca2SiO4:Eu2+ phosphor synthesized using a liquid phase precursor method, Journal of Alloys and Compounds, 2014, 608, 311-317.

95. Sun Wook Kim, Dae Seop Byeon, Hyunchul Jang, Sang Mo Koo, Hoo Jeong Lee, and Dae Hong Ko

Strain characterization of fin-shaped field effect transistors with SiGe stressors using nanobeam electron diffraction, Applied Physics Letters, 2014, 105, 083104.

94. Young Joo Lee, Han Wool Yeon, Sung Yup Jung, Se Kwon Na, Jong Seung Park, Yong Yoon Choi, Hoo Jeong Lee, Oh Sung Song, and Young Chang Joo

Effects of film thickness and deposition rate on the diffusion barrier performance of titanium nitride in Cu-through silicon vias, Electronic Materials Letters, 2014, 10, 275-279.

93. Juyun Choi, Seongheum Choi, Yu Seon Kang, Sekwon Na, Hoo-Jeong Lee, Mann Ho Cho, and Hyoungsub Kim

Defect-free erbium silicide formation using an ultrathin Ni interlayer, ACS Applied Materials & Interfaces, 2014, 6, 14712-14717.

2013

92. Juyun Choi, Seongheum Choi, Jungwoo Kim, Sekwon Na, Hoo Jeong Lee, and Seok Hee Lee, Hyoungsub Kim

Silicide formation process of Er films with Ta and TaN capping layers, ACS Applied Materials & Interfaces, 2013, 5, 12744-12750.

91. Jong Woong Kim, Hoo Jeong Lee, and Seung Boo Jung

Effect of surface treatment on the high-speed drop reliability of Pb-free solder interconnect, Thin Solid Films, 2013, 547, 120-124.

90. S. W. Kim, J. H. Yoo, S. M. Koo, H. J. Lee, and D. H. Ko

Strain behavior of epitaxial Si1−xCx films on silicon substrates during dry oxidation, Thin Solid Films, 2013, 546, 226-230.

89. Byunghoon Lee, Haseok Jeon, Kee Won Kwon, and Hoo Jeong Lee

Employment of a bi-layer of Ni(P)/Cu as a diffusion barrier in a Cu/Sn/Cu bonding structure for three-dimensional interconnects, Acta Materialia, 2013, 61, 6736-6742.

88. Minsub Oh, Sekwon Na, Younghak Song, Chang Su Woo, Jun Ho Jeong, Seungmin Hyun, Sung Soo Kim and Hoo jeong Lee

Enhancement of Cyclic Stability of Si Anode by Employing Plasma Treatment and Ti Adhesion Layer, Electrochemistry Letters, 2013, 2, A102.

87. Haseok Jeon, Jury Song, Sekwon Na, Miran Moon, Junhyung Lim, Jinho Joo, Donggun Jung, Hyungsub Kim, Jinsoo Noh, and Hoo Jeong Lee

A study on the microstructural and chemical evolution of In–Ga–Zn–O sol–gel films and the effects on the electrical properties, Thin Solid Films, 2013, 540, 31-35.

86. Mi Ran Moon, Haseok Jeon, Sekwon Na, Sunho Kim, Donggeun Jung, Hyoungsub Kim, and Hoo Jeong Lee

Microstructure and electrical properties of XInZnO (X = Ti, Zr, Hf) films and device performance of their thin film transistors-The effects of employing Group IV-B elements in place of Ga, Journal of Alloys and Compounds, 2013, 563, 124-129.

85. Sun Wook Kim, Dae Seop Byun, Mijin Jung, Saurabh Chopra, Yihwan Kim, Jae Hyun Kim, Seung Min Han, Dae Hong Ko and Hoo Jeong Lee

Channel Strain Measurement of Si1-xCx Structures: Effects of Gate Length, Source/Drain Length, and Source/Drain Elevation, Applied Physics Express, 2013, 6, 066601.

84. Jeong Eun Lee, Bhupendra K. Sharma, Seoung Ki Lee, Haseok Jeon, Byung Hee Hong, Hoo Jeong Lee, and Jong Hyun Ahn

Thermal stability of metal Ohmic contacts in indium gallium zinc oxide transistors using a graphene barrier layer, Applied Physics Letters, 2013, 102, 113112.

83. Seong jae Jeon, Haseok Jeon, Sekwon Na, Stephen D. Kang, Ho Ki Lyeo, Seungmin Hyun, Hoo Jeong Lee

Microstructure evolution of sputtered BiSb–Te thermoelectric films during post-annealing and its effects on the thermoelectric properties, Journal of Alloys and Compounds, 2013, 553, 343-349.

82. Soonjae Kim, Sekwon Na, Haseok Jeon, Sunho Kim, Byunghoon Lee, Jaehyun Yang, Hyoungsub Kim, and Hoo Jeong Lee

Effects of Sn doping on the growth morphology and electrical properties of ZnO nanowires, Nanotechnology, 2013, 24, 065703.

81. Seunghyun Hong, Wonyoung Kim, Seong Jae Jeon, Seong Chu Lim, Hoo Jeong Lee, Seungmin Hyun, Young Hee Lee, and Seunghyun Baik

Enhanced Electrical Potential of Thermoelectric Power Waves by Sb2Te3 Coated Multiwalled Carbon Nanotube Arrays, The Journal of Physical Chemical C, 2013, 117, 913-917.

2012

80. Minsub Oh, Seong jae Jeon, Haseok Jeon, Seungmin Hyun, and Hoo jeong Lee

A Study on Sputtered Bi-Te Thermoelectric Films with Various Compositions: Microstructure Evolution and the Effects on Thermoelectric and Electrical Properties, Journal of Electronic Materials, 2012, 41, 60-66.

79. Byunghoon Lee, Haseok Jeon, Soonjae Kim, Kee won Kwon, Jong Woong Kim and Hoo jeong Lee

Introduction of an Electroless-Plated Ni Diffusion Barrier in Cu/Sn/Cu Bonding Structures for 3D Integration, Journal of The Electrochemical Society, 2012, 159, H85.

78. Byunghoon Lee, Haseok Jeon, Seong Jae Jeon, Kee Won Kwon, and Hoo Jeong Lee

A Study on the Breakdown Mechanism of an Electroless-Plated Ni (P) Diffusion Barrier for Cu/Sn/Cu 3D Interconnect Bonding Structures, Journal of Electronic Materials, 2012, 41, 109-114.

77. Seongjae Jeon, Jong Woong Kim, Byunghoon Lee, Hak Joo Lee, Seung Boo Jung, Seungmin Hyun, and Hoo Jeong Lee

Evaluation of drop reliability of Sn37Pb solder/Cu joints using a high speed lap-shear test, Microelectronic Engineering, 2012, 91, 147-153.

76. D. I. Kim, B. U. Hwang, J. S. Park, H. S. Jeon, B. S. Bae, H. J. Lee, and N. E. Lee

Mechanical bending of flexible complementary inverters based on organic and oxide thin film transistors, Organic Electronics, 2012, 13, 2401-2405.

75. Seunghyun Hong, Eun Sung Kim, Wonyoung Kim, Seong-Jae Jeon, Seong Chu Lim, Ki Hong Kim, Hoo Jeong Lee, Seungmin Hyun, Duckjong Kim, Jae-Young Choi, Young Hee Lee, and Seunghyun Baik

A hybridized graphene carrier highway for enhanced thermoelectric power generation, Physical Chemistry Chemical Physics, 2012, 14, 13527-13531.

74. Dae Hong Ko, Sun Wook Kima, Sangmo Koo, Mijin Jung, and Hoo Jeong Lee

The Effect of Ge Condensation on Channel Strain during the Post Annealing Process of Recessed Source/Drain Si1-xGex, ISTDM, 2012.

73. Sekwon Na, Hwayoul Choi, Byunghoon Lee, Juyun Choi, Yujin Seo, Hyoungsub Kim, Seok Hee Lee, and Hoo Jeong Lee

A study on the formation mechanism of ytterbium silicide for Schottky contact applications, Surface and Interface Analysis, 2012, 44, 1497-1502.

72. Mi Ran Moon, Sekwon Na, Haseok Jeon, Tae Hun Lee, Donggeun Jung, Hyoungsub Kim, Jun Mo Yang, and Hoo Jeong Lee

The effects of a combined thermal treatment of substrate heating and post-annealing on the microstructure of InGaZnO films and the device performance of their thin film transistors, Surface and Interface Analysis, 2012, 44, 1431-1535.

71. Kim, Sang Yeon; Kim, Sun Wook; Ko, Dae Hong; Lee, Hoo Jeong

Ge Oxidation in the Remaining Cores of Si1–x Gex Nanowires After Prolonged Oxidation, Journal of Nanoscience and Nanotechnology, 2012, 12, 3650-3654.

70. Byung Hyun Kwak, Myeong Hyeok Jeong, Jae Won Kim, Byung hoon, Lee, Hoo Jeong Lee, and Young Bae Park

Correlations between interfacial reactions and bonding strengths of Cu/Sn/Cu pillar bump, Microelectronic Engineering, 2012, 89, 65-69.

2011

69. S. W. Kim, J. H. Yoo, S. M. Koo, D. H. Ko, and H. J. Lee

Characterization of channel strain evolution upon the silicidation of recessed source/drain Si1-xGex structures, Applied Physics Letters, 2011, 99, 133107.

68. Byunghoon Lee and Hoo jeong Lee

Microstructure evolution of Cu/Sn/Cu bonding stacks impacts on their mechanical properties, IPFA, 2011.

67. Jaehyun Yang, Myung Soo Lee, Kyung Park,Mi Ran Moon, Donggeun Jung, Hyoungsub Kim, and Hoo Jeong Lee

Effects of the microstructure of ZnO seed layer on the ZnO nanowire density, Journal of Materials Research, 2011, 26, 1292-1297.

66. Seongjae Jeon, Minsub Oh, Haseok Jeon, Seungmin Hyun, and Hoo jeong Lee

Effect of post-annealing on thermoelectric properties of bismuth-tellurium thin films deposited by co-sputtering, Microelectronic Engineering, 2011, 88, 541,544.

65. Byunghoon Lee, Jongseo Park, Junghyun Song, Keewon Kwon, and Hoo Jeong Lee

Effects of Bonding Temperature and Pressure on the Electrical Resistance of Cu/Sn/Cu Joints for 3D Integration Applications, Journal of Electronic Materials, 2011, 40, 324-329.

64. Haseok Jeon, Sekwon Na, Mi Ran Moon, Donggeun Jung, Hyoungsub Kim and Hoo Jeong Lee

The effects of the Zn ratio on the microstructure of InGaZnO films and the device performance of their thin film transistors, Journal of The Electrochemical Society, 2011, 158, H949.

63. Seong jae Jeon, Minsub Oh, Haseok Jeon, Stephen D. Kang, Ho Ki Lyeo, Seungmin Hyun and Hoo jeong Lee

Microstructure Evolution of Sputtered Bi-Te Films during Post-Annealing: Phase Transformation and Its Effects on the Thermoelectric Properties, Journal of The Electrochemical Society, 2011, 158, H808.

62. J. H. Yoo, S. W. Kim, S. M. Koo, D. H. Ko, and H. J. Lee

Achievement of a high channel strain via dry oxidation of recessed source/drain Si1-xGex structures, Applied Physics Letters, 2011, 98, 253106.

61. Jaehyun Yang, Myung Soo Lee, Hoo Jeong Lee, and Hyoungsub Kim

Hybrid ZnO nanowire networked field-effect transistor with solution-processed InGaZnO film, Applied Physics Letters, 2011, 98, 253106.

60. Kyung Park, Ju Yun Choi, Hoo Jeong Lee, Jang Yeon Kwon, and Hyoungsub Kim

Thin Film Transistor Using Amorphous InGaZnO Films as Both Channel and Source/Drain Electrodes, Japanese Journal of Applied Physics, 2011, 50, 096504.

2010

59. Mi Ran Moon, Sekwon Na, Haseok Jeon, Chee-Hong An, Kyung Park, Donggeun Jung, Hyoungsub Kim, Young-Boo Lee, and Hoo Jeong Lee

Effects of Substrate Heating on the Amorphous Structure of InGaZnO Films and the Electrical Properties of Their Thin Film Transistors, Applied Physics Express, 2010, 3, 111101

58. Y. S. Kang, C. Y. Kim, M. H. Cho, K. B. Chung, C. H. An, H. Kim, H. J. Lee, C. S. Kim, and T. G. Lee

Thickness dependence on crystalline structure and interfacial reactions in HfO2 films on InP (001) grown by atomic layer deposition, Applied Physics Letters, 2010, 97, 172108.

57. C. Y. Kim, Y. S. Kang, S. Y. Lee, M. H. Cho, K. B. Chung, H. Kim, S. Na, H. J. Lee, and H. J. Yun

Effect of interfacial reactions between atomic-layer-deposited HfO2 films and n-GaAs (100) substrate using postnitridation with NH3 vapor, Applied Physics Letters, 2010, 97, 092113.

56. Kyungyea Park, Deok Kyou Lee, Byung Sung Kim, Haseok Jeon, Nae Eung Lee, Dongmok Whang, Hoo Jeong Lee, Youn Jea Kim, and Jong Hyun Ahn.

Stretchable, Transparent Zinc Oxide Thin Film Transistors, Advanced Functional Materials, 2010, 20, 3577-3582.

55. Sang-Yeon Kim, Hoo Jeong Lee, and Dae-Hong Ko.

Agglomeration of Cylindrically Condensed Cores in Si1-xGex Nanowires by Oxidation, Electrochemical and Solid-State Letters, 2010, 13, K57-K59.

54. Sang Su Ha, Jin Kyu Jang, Sang Ok Ha, Jeong Won Yoon, Hoo Jeong Lee, Jin Ho Joo, Young Ho Kim, Seung Boo Jung.

Effect of multiple reflows on interfacial reaction and shear strength of Sn-Ag electroplated solder bumps for flip chip package, Microelectronic Engineering, 2010, 87, 517-521.

53. Y. J. Cho, J. W. Mah, C. Y. Kim, H. Kim, H. J. Lee, H. J. Kang, D. W. Moon, S. O. Kim, M. H. Cho

Change in Band Alignment of Nitrided Hf-Silicate Films Grown on Ge(001) Using Gaseous NH3, Electrochemical and Solid-State Letters, 2010, 13, G33-G36,

52. Byunghoon Lee, Jongseo Park, Seong-jae Jeon, Kee-won Kwon, and Hoo-jeong Lee

A Study on the Bonding Process of Cu Bump/Sn/Cu Bump Bonding Structure for 3D Packaging Applications, Journal of The Electrochemical Society, 2010, 157, H420-H424.

51. Kyung Park, Chee Hong An, Byung Il Hwang, Hoo Jeong Lee, Hyoungsub Kim, Kyungseok Son, Jang Yeon Kwon, and Sangyun Lee.

A study on materials interactions between Mo electrode and InGaZnO active layer in InGaZnO-based thin film transistors, Journal of Materials Research, 2010, 25, 266.

50. Myung Soo Lee, Chee Hong An, Jun Hyung Lim, Jin Ho Joo, Hoo Jeong Lee, and Hyoungsub Kim

Characteristics of Ce-Doped ZrO2 Dielectric Films Prepared by a Solution Deposition Process, Journal of The Electrochemical Society, 2010, 157, G142-G146.

2009

49. C. Y. Kim, S. W. Cho, M. H. Cho, K. B. Chung, D. C. Suh, D. H. Ko, C. H. An, H. Kim, and H. J. Lee.

Changes in the structure of an atomic-layer-deposited HfO2 film on a GaAs(100) substrate as a function of postannealing temperature, Applied Physics Letters, 2009, 95, 042903.

48. Jun Hyung Lim, Jong Hyun Shim, Jun Hyuk Choi, Jinho Joo, Kyung Park, Haseok Jeon, Mi Ran Moon, Donggeun Jung, Hyoungsub Kim, and Hoo Jeong Lee.

Solution-processed InGaZnO-based thin film transistors for printed electronics applications, Applied Physics Letters, 2009, 95, 012108.

47. K. Park, C. H. An, M. S. Lee, C. W. Yang, H. J. Lee, and H. Kim

Microstructural Evolution and Electrical Characteristics of Co-Germanide Contacts on Ge, Journal of The Electrochemical Society, 2008, 156, H229-H232.

46. Soo Min HWANG, Jun Hyung LIM, Chang Min LEE, Eui Cheol PARK, Jun Hyuk CHOI, Jinho JOO, Hoo-Jeong LEE, Seung Boo JUNG.

Fabrication of two-layer flexible copper clad laminate by electroless-Cu plating on surface modified polyimide, Transactions of Nonferrous Metals Society of China, 2009, 19, 970-974.

45. Mi Ran Moon, Eunkyoung Nam, Jihyung Woo, Sungwoo Lee, Kyung Park, Donggeun Jung, Hyoungsub Kim, and Hoo Jeong Lee.

Effects of surface treatments using PECVD-grown hexamethyldisiloxane on the performance of organic thin-film transistor, Thin Solid Films, 2009, 517, 4161-4164.

44. H. J. Lee, X. Huang, K. P. Mohanchandra, G. Carmanc, and A. G. Ramirez.

Effects of surface treatments using PECVD-grown hexamethyldisiloxane on the performance of organic thin-film transistor, Scripta Materialia, 2009, 60, 1133-1136.

2008

43. C. Y. Kim, S. W. Cho, M. H. Cho, K. B. Chung, C. H. An, H. Kim, H. J. Lee, and D. H. Ko

Interfacial reaction of atomic-layer-deposited HfO2 film as a function of the surface state of an n-GaAs (100) substrate, Applied Physics Letters, 2008, 93, 192902.

42. J. Cho, W. J. Lee, C. Y. Kim, M. H. Cho, H. Kim, H. J. Lee, D. W. Moon, and H. J. Kang

Band gap change and interfacial reaction in Hf-silicate film grown on Ge(001), Journal of Chemical Physics, 2008, 129, 164117.

41. Byung Il Hwang, Kyung Park, Ha Suk Chun, Chee Hong An, Hyoungsub Kim, and Hoo Jeong Lee.

The effects of the microstructure of ZnO films on the electrical performance of their thin film transistors, Applied Physics Letters, 2008, 93, 222104.

40. Jeong Won Yoon, Hyun Suk Chun, Bo In Noh, Ja Myeong Koo, Jong Woong Kim, Hoo Jeong Lee, and Seung Boo Jung.

Mechanical reliability of Sn-rich Au–Sn/Ni flip chip solder joints fabricated by sequential electroplating method, Microelectronics Reliability, 2008, 48, 1857-1863.

39. Xu Huang, Hoo Jeong Lee, and A. G. Ramirez.

Incomplete martensitic transformations in NiTi thin films, Scripta Materialia, 2008, 59, 1067-1070.

38. Jaeyoung PARK, Jinhee PARK, Nayoung KIM, Hoo-Jeong LEE, and Moonsuk YI Performance Enhancement of Organic Thin-Film Transistors with C60/Au Bi layer Electrode, Japanese Journal of Applied Physics, 2008, 47, 5668-5671.

37. Seong jae Jeon, Seungmin Hyun, Hak-JooLee, Jong Woong Kim, Sang Su Ha, Jeong Won Yoon, Seung Boo Jung, Hoo Jeong Lee

Mechanical reliability evaluation of Sn-37Pb solder joint using high speed lap-shear test, Microelectronic Engineering, 2008, 85, 1967-1970.

36. Yoonsung Han, Sanghoon Kim, Sangho Lee, and Jongill Hong, Dong Ryeol Lee, Hyun Hwi Lee, and Yong Jun Park, and Hoojeong Lee

Effects of H-ion irradiation on the properties of a spin valve, Journal of Applied Physics, 2008, 103, 07B521.

2007

35. Chang Yong Lee, Jae Hong Lee, Don-Hyun Choi, Hoo Jeong Lee, Hyoung Sub Kim, Seung Boo Jung, Won Chul Moon

Effects of nodule treatment of rolled copper on the mechanical properties of the flexible copper-clad laminate, Microelectronic Engineering, 2007, 84, 2653-2657.

34. Jeong Won Yoon, Hyun Suk Chun, Hoo Jeong Lee, and Seung Boo Jung.

Microstructural evolution and interfacial reactions of fluxless-bonded Au-20Sn/Cu solder joint during reflow and aging, Journal of Materials Research, 2007, 22, 2817-2824.

33. J. H. Lim, S. H. Jang, K. T. Kim, S. M. Hwang, J. Joo, H. J. Lee, H. G. Lee, and G. W. Hong.

The effect of film thickness on critical properties of YBCO film fabricated by TFA-MOD using 211-process, Physica C: Superconductivity and its Applications, 2007, 463-465, 532-535.

32. Jun Hyung Lim, Eui Cheol Park, Seung Yi Lee, Jeong Won Yoon, Sang-Su Ha, Jinho Joo, Hoo Jeong Lee, Seung Boo Jung , and Keun Song

Fabrication of Ni Metal Mask by Electroforming Process Using Wetting Agents, Journal of Electronic Materials, 2007, 36, 1510-1515.

31. JEONG-WON YOON, HYUN-SUK CHUN, HAN-BYUL KANG, MIN-HO PARK, CHEOL-WOONG YANG, HOO-JEONG LEE and SEUNG-BOO JUNG.

Morphology, Thermal Stability, and Solderability of Electroless Nickel-Phosphorus Plating Layer, Surface Review and Letters, 2007, 14, 827-832.

30. Kyu Tae Kim, Jun Hyung Lim, Seok Hern Jang, Jinho Joo, Hoo Jeong Lee, Gye Won Hong, Chan Joong Kim, Hye Rim Kim, and Ok Bae Hyun.

A Study on the Processing Variables of the BSCCO-2212 Bulk Superconductors, Applied Superconductivity, 2007, 17, 3004.

29. Jun Hyung Lim, Seok Hern Jang, Seung Yi Lee, Kyung Min Yoon, Kyu Tae Kim, Jin Ho Joo, Hoo Jeong Lee, Hee Gyoun Lee, and Gye Won Hong.

Effects of firing temperature and film thickness on the critical properties of YBCO film by the “11 process, Solid State Phenomena, 2007, 124-126, 243-246.

28. Jong Woong Kim, Dae Gon Kim, Ja Myeong Koo, Jeong Won Yoon, Sunglak Choi, Kyung Sik Kim, Jae Do Nam, Hoo Jeong Lee, Jinho Joo, and Seung Boo Jung

Characterization of failure behaviors in anisotropic conductive interconnection, Materials Transactions, 2007, 48, 1070-1078.

27. Jeong Won Yoon, Hyun Suk Chun, Ja Myeong Koo, Hoo Jeong Lee, and Seung Boo Jung.

Microstructural evolution of Sn-rich Au–Sn/Ni flip-chip solder joints under high temperature storage testing conditions, Scripta Materialia, 2007, 56, 661-664.

26. Sungku KANG，Jaeyoung PARK, Sukmo JUNG, Hoo Jeong LEE, Philkook SON, Jae Chang KIM, Tae Hoon YOON, and Moonsuk YI

Performance Enhancement of Organic Thin Film Transistors by low-energy Argon Ion Beam Treatment of Gate Dielectric Surface, Japanese Journal of Applied Physics, 2007, 46, 2696.

25. Jun Hyung Lim, Kyu Tae Kim, Eui Cheol Park, Jin Ho Joo, Hyoung Sub Kim, Hoo Jeong Lee, Seung Boo Jung, Wan Soo Nah

Texture Evolution in Ni Substrate Prepared by Powder Metallurgy and Casting Methods, Materials Science Forum, 2007, 534-536, 1605-1608.

24. Kyu Tae Kim, Seok Hern Jang, Jun Hyung Lim, Eui Cheol Park, Jin Ho Joo, Hoo Jeong Lee, Gye Won Hong, Chan Joong Kim, Hye Rim Kim, Ok Bae Hyun

Fabrication of Bi-2212/SrSO4 Composite Superconductors by Melting Powder Mixtures, Materials Science Forum, 2007, 534-536, 1597-1600.

23. Jun Hyung Lim, Seok Hern Jang, Kyung Min Yoon, Seung Yi Lee, Jin Ho Joo, Hoo Jeong Lee, Chan Joong Kim

Fabrication of TFA-MOD YBCO Films Using the Y2Ba1Cu1Ox and Ba3Cu5O8 Powders, Materials Science Forum, 2007, 534-536, 1601-1604.

22. Seok Hern Jang, Jun Hyung Lim, Jin Sung Lee, Kyung Min Yoon, Kyu Tae Kim, Jinho Joo, Seung Boo Jung, Hoo Jeong Lee.

Effects of heat treatment and film thickness on microstructure and critical properties of YBCO film processed by TFA-MOD, Physica C: Superconductivity and its Applications, 2007, 451, 118-126.

21. Sungku Kang, Sukmo Jung, Jaeyoung Park, Hoo Jeong Lee, and Moonsuk Yi.

Gate Dielectric Surface Treatment Techniques for Organic Thin Film Transistor, Microelectronic Engineering, 2007, 84, 1503-1506.

Before 2006

20. Jeong Won Yoon, Jun Hyung Lim, Hoo Jeong Lee, Jinho Joo, and Seung Boo Jung, and Won Chul Moon, Interfacial reactions and joint strength of Sn-37Pb and Sn-3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150℃, Journal of Materials Research, 2006, 21, 3196.

19. Ainissa G. Ramirez, Hai Ni, and Hoo Jeong Lee,

Crystallization of Amorphous Sputtered NiTi thin films, Materials Science and Engineering: A, 2006, 438-440, 703-709.

18. Hoo Jeong Lee, Hai Ni, David T. Wu, and Ainissa G. Ramirez.

A Microstructural Map of Crystallized NiTi Thin Film Derived from In Situ TEM, Materials Transactions, 2006, 47, 527-531.

17. Hoo Jeong Lee, Hai Ni, David T. Wu, and Ainissa G. Ramirez.

Grain size estimations from the direct measurement of nucleation and growth, Applied Physics Letters, 2005, 87, 124102.

16. Hoo Jeong Lee, Hai Ni, David T. Wu, and Ainissa G. Ramirez.

Experimental determination of kinetic parameters for crystallizing amorphous NiTi thin films, Applied Physics Letters, 2005, 87, 114102.

15. Hai Ni, Hoo Jeong Lee, and Ainissa G. Ramirez.

Compositional effects on the crystallization kinetic of nickel titanium thin films, Journal of Materials Research, 2005, 20, 1728-1734.

14. Hai Ni, Hoo Jeong Lee, and Ainissa G. Ramirez.

A robust two-step etching process for large-scale microfabricated SiO2 and Si3N4 MEMS membrane, Sensors and Actuators A: Physical, 2005, 119, 553-558.

13. Hoo Jeong Lee, Ping Zhang, and John C. Bravman.

Stress relaxation in free-standing Aluminum beams, Thin Solid Film, 2005, 476, 118-124.

12. Hoo Jeong Lee and Ainissa G. Ramirez.

Crystallization and phase transformations in amorphous NiTi thin films for microelectromechanical systems, Applied Physics Letters, 2004, 85, 1146.

11. Hoo Jeong Lee, Ping Zhang, and John C. Bravman.

Study on the strength and elongation of free-standing Al beams for microelectromechanical systems applications, Applied Physics Letters, 2004, 84, 915.

10. Hoo-Jeong Lee, Ping Zhang, and John C. Bravman.

Tensile Failure of Free-standing Al Beams for MEMS applications, Journal of Applied Physics, 93, 2003, 1443.

9. S. Spruytte, C. Coldren,J. Harris, D. Pantelidis, Hoo Jeong Lee, J. Bravman, and M. Kelly.

Use of angle resolved X-ray photoelectron spectroscopy for determination of depth and thickness of layer structures, Journal of Vacuum Science & Technology, 2001, 19, 603

8. Seok Woo Nam, Jung Ho Yoo, Hae Young Kim, Sung Kwan Kang, Dae Hong Ko, Cheol Woong Yang, Hoo Jeong Lee, Mann Ho Cho, and Ja Hum Ku.

A Study of ZrO2 Thin Films for Gate Oxide Applications, Journal of Vacuum Science & Technology, 2001, 19, 1720

7. Jung Ho Yoo, Seok Woo Nam, Sung Kwan Kang, Yun Ha Jeong, Dae Hong Ko, Ja Hum Ku, and Hoo Jeong Lee.

A Study on the Microstructure and Electrical Properties of CeO2 Thin Films For Gate Dielectric Application, Microelectronic Engineering, 2001, 56, 187-190.

6. Deok Hyung LEE, Dae-Hong KO, Ja-Hum KU, Siyoung CHO, Kazuyuki FUJIHARA, Ho Kyu KANG, Sang-Ho OH, Chan-Gyung PARK, and Hoo-Jeung LEE.

Formation of High-Temperature Stable Co-Silicide from Co0.92Ta0.08/Si Systems, Japanese Journal of Applied Physics, 2001, 40, 2712.

5. Hoo Jeong Lee, Guido Cornella, and John C. Bravman.

Stress Relaxation of Free-standing Aluminum Beams for MEMS applications, Applied Physics Letters, 2000, 76, 3415.

4. Hoo Jeong Lee, Kee-Won Kwon, Changsup Ryu, and Robert Sinclair.

Thermal stability of a Cu/Ta multilayer: an intriguing interfacial reaction, Acta Materialia, 1999, 47, 3965-3975.

3. Kee Won Kwon, Hoo Jeong Lee, and Robert Sinclair.

Solid-state amorphization at tetragonal-Ta/Cu interfaces, Applied Physics Letters, 1999, 75, 935.

2. Hoojeong Lee, Robert Sinclair, Pamela Li, and Bruce Roberts.

A Study of Failure Mechanism of TiN Diffusion Barrier, Journal of Applied Physics, 1999, 86, 3096.

1. Sam‐Dong Kim, Hoojeong Lee and James S. Harris Jr.